درباره ما
IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 361-380 of 793
-
IPC TM-650 2.6.27
Abstract: This method shall be used to simulate exposure to the thermal conditions of convection reflow assembly.
Purpose This method shall be used to replicate the thermodynamic effects of ... -
IPC SMC-WP-003
Abstract: INTRODUCTION
The purpose of this paper is to investigate emerging chip attachment methods and define and classify the attachment methods for electronic systems designers and manufacturers today. The ... -
IPC 7525A GERMAN
Abstract: Dieses Dokument enthält Anleitungen für das Design und die Herstellung von Schablonen für Lotpaste und SMD-Kleber. Es ist nur als Richtschnur zu betrachten, da ein großer Teil der Angaben auf den ... -
IPC 1601
Abstract: This document provides suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. These guidelines are intended to protect printed boards from contamination, ... -
IPC 6017
Abstract: Statement of Scope This specification covers qualification and performance of in-process and finished printed boards (PBs) containing embedded passive circuitry with distributive capacitive planes, capacitive or resistive ... -
IPC TM-650 2.2.14
Abstract: A method for determining whether or not the powder in a solder paste complies with the relevant powder type. The ASTM B-214 standard screen powder size distribution method has been found to be acceptable. -
IPC TM-650 2.5.13A
Abstract: This test method is used to determine the resistivity of copper foil. -
IPC TM-650 2.3.10B
Abstract: This test method is designed to determine the degree of flame resistance of metal-clad or unclad laminate. It is intended for use on laminate of thicknesses 0.51 mm [0.020 inch] and greater. -
IPC J-STD-003C
Abstract: This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes (PTHs). This standard is ... -
IPC TM-650 2.4.34.3
Abstract: This test specifies a standard procedure for determining the viscosity of solder paste in the range of 50,000 to 300,000 centipoise. -
IPC WP/TR-584A
Abstract: This document summarizes the IPC position on the subject of ‘‘halogen-free'' materials for the electronics industry. Its initial release was developed over a period of three years and this revision was also ... -
IPC TM-650 2.4.29C
Abstract: This test method is used to determine the adhesion quality of solder masks used on flexible circuits. -
IPC 9641
Abstract: The purpose of this test method is to measure the shape and relative change in shape of a local area of interest (e.g., flip-chip ball grid array (FCBGA) land area) of printed boards through a range of temperatures typical ... -
IPC TM-650 2.4.18.1A
Abstract: To determine the tensile strength in Mpa (PSI) and the elongation, in percentage, of electrodeposited copper plating at ambient temperatures by mechanical force testing. -
IPC A-600G POLISH
Abstract: Niniejszy dokument opisuje stany preferowane, dopuszczalne i niezgodne z wymaganiami, które są dostrzegalne na zewnątrz lub wewnątrz płytek obwodów drukowanych. Dokument przedstawia interpretacje ...