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IPC 9701A CHINESE

English -- Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments;
Chinese -- 表面贴装焊接连接 的性能测试方法 及鉴定要求

Organization:
IPC - Association Connecting Electronics Industries
Year: 2006

Abstract: This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
URI: http://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/201717
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    IPC 9701A CHINESE

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:19:02Z
date available2017-09-04T18:19:02Z
date copyright02/01/2006
date issued2006
identifier otherHSYMADAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/201717
description abstractThis specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
languageChinese
titleIPC 9701A CHINESEnum
titleEnglish -- Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachmentsen
titleChinese -- 表面贴装焊接连接 的性能测试方法 及鉴定要求other
typestandard
page32
statusActive
treeIPC - Association Connecting Electronics Industries:;2006
contenttypefulltext
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