IPC 9701A CHINESE
English -- Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments;
Chinese -- 表面贴装焊接连接 的性能测试方法 及鉴定要求
Organization:
IPC - Association Connecting Electronics Industries
Year: 2006
Abstract: This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies.
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IPC 9701A CHINESE
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contributor author | IPC - Association Connecting Electronics Industries | |
date accessioned | 2017-09-04T18:19:02Z | |
date available | 2017-09-04T18:19:02Z | |
date copyright | 02/01/2006 | |
date issued | 2006 | |
identifier other | HSYMADAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/201717 | |
description abstract | This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies. | |
language | Chinese | |
title | IPC 9701A CHINESE | num |
title | English -- Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments | en |
title | Chinese -- 表面贴装焊接连接 的性能测试方法 及鉴定要求 | other |
type | standard | |
page | 32 | |
status | Active | |
tree | IPC - Association Connecting Electronics Industries:;2006 | |
contenttype | fulltext |