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IPC 4101D
Specification for Base Materials for Rigid and Multilayer Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2014
Abstract: This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:46:33Z | |
| date available | 2017-09-04T18:46:33Z | |
| date copyright | 2014.04.01 | |
| date issued | 2014 | |
| identifier other | KJUTHFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/227803 | |
| description abstract | This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. | |
| language | English | |
| title | IPC 4101D | num |
| title | Specification for Base Materials for Rigid and Multilayer Printed Boards | en |
| type | standard | |
| page | 168 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2014 | |
| contenttype | fulltext |