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IPC 6018C

English -- Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Organization:
IPC - Association Connecting Electronics Industries
Year: 2016

Abstract: Scope: Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers. Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (microwave) printed boards.
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    IPC 6018C

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-10-18T11:09:46Z
date available2017-10-18T11:09:46Z
date copyright2016.07.01
date issued2016
identifier otherXBZERFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessionid=22E9669814B1A2CD62B816A309F4CAB6/handle/yse/235823
description abstractScope: Statement of Scope This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers. Purpose The purpose of this specification is to provide requirements for qualification and performance of high frequency (microwave) printed boards.
languageEnglish
titleIPC 6018Cnum
titleEnglish -- Qualification and Performance Specification for High Frequency (Microwave) Printed Boardsen
typestandard
page64
statusActive
treeIPC - Association Connecting Electronics Industries:;2016
contenttypefulltext
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