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IPC TM-650 2.6.27
Thermal Stress, Convection Reflow Assembly Simulation
Organization:
IPC - Association Connecting Electronics Industries
Year: 2009
Abstract: This method shall be used to simulate exposure to the thermal conditions of convection reflow assembly.
Purpose This method shall be used to replicate the thermodynamic effects of assembly on the test specimen. The use of this method in accordance with the requirements defined herein shall cover those effects that are the result of convection reflow assembly, rework or repair.
This method shall be used for qualification testing of an applicable test specimen. The evaluation of acceptability for qualification shall be in accordance with the requirements defined in 5.3.
This method may be used for lot acceptance.The evaluation for lot acceptability should be in accordance with the requirements defined in 5.3 or as agreed upon between user and supplier (AABUS).
Purpose This method shall be used to replicate the thermodynamic effects of assembly on the test specimen. The use of this method in accordance with the requirements defined herein shall cover those effects that are the result of convection reflow assembly, rework or repair.
This method shall be used for qualification testing of an applicable test specimen. The evaluation of acceptability for qualification shall be in accordance with the requirements defined in 5.3.
This method may be used for lot acceptance.The evaluation for lot acceptability should be in accordance with the requirements defined in 5.3 or as agreed upon between user and supplier (AABUS).
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IPC TM-650 2.6.27
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:09:13Z | |
| date available | 2017-09-04T17:09:13Z | |
| date copyright | 05/01/2009 | |
| date issued | 2009 | |
| identifier other | YMGMMCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/132691 | |
| description abstract | This method shall be used to simulate exposure to the thermal conditions of convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects of assembly on the test specimen. The use of this method in accordance with the requirements defined herein shall cover those effects that are the result of convection reflow assembly, rework or repair. This method shall be used for qualification testing of an applicable test specimen. The evaluation of acceptability for qualification shall be in accordance with the requirements defined in 5.3. This method may be used for lot acceptance.The evaluation for lot acceptability should be in accordance with the requirements defined in 5.3 or as agreed upon between user and supplier (AABUS). | |
| language | English | |
| title | IPC TM-650 2.6.27 | num |
| title | Thermal Stress, Convection Reflow Assembly Simulation | en |
| type | standard | |
| page | 8 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2009 | |
| contenttype | fulltext |