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IPC IPC/JEDEC J-STD-033C-1
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Organization:
IPC - Association Connecting Electronics Industries
Year: 2014
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IPC IPC/JEDEC J-STD-033C-1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:12:29Z | |
| date available | 2017-09-04T17:12:29Z | |
| date copyright | 2014.08.01 | |
| date issued | 2014 | |
| identifier other | CAMUJFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/135990 | |
| language | English | |
| title | IPC IPC/JEDEC J-STD-033C-1 | num |
| title | Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices | en |
| type | standard | |
| page | 28 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2014 | |
| contenttype | fulltext |