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IPC TM-650 2.6.9.2
Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: The purpose of this test method is to provide a consistent procedure to test the sensitivity of electronic components to ultrasonic energy. There has been reluctance in the electronics industry to use ultrasonic energy for printed board assembly cleaning because of the possibility of damage to wire bonds in active, hermetically sealed components or other damage that might cause latent failures. Recent work has shown that electronic components have a low potential for damage from ultrasonics (References 1-7) under conditions seen in most cleaning processes. In addition, MIL-STD-2000 Rev. A and J-STD-001 now allow for the use of ultrasonic cleaning, as does the proposal for IEC TC91 International Standards based on an updated revision of the J-STD-001.
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IPC TM-650 2.6.9.2
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:16:04Z | |
| date available | 2017-09-04T17:16:04Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | ZETTCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/139470 | |
| description abstract | The purpose of this test method is to provide a consistent procedure to test the sensitivity of electronic components to ultrasonic energy. There has been reluctance in the electronics industry to use ultrasonic energy for printed board assembly cleaning because of the possibility of damage to wire bonds in active, hermetically sealed components or other damage that might cause latent failures. Recent work has shown that electronic components have a low potential for damage from ultrasonics (References 1-7) under conditions seen in most cleaning processes. In addition, MIL-STD-2000 Rev. A and J-STD-001 now allow for the use of ultrasonic cleaning, as does the proposal for IEC TC91 International Standards based on an updated revision of the J-STD-001. | |
| language | English | |
| title | IPC TM-650 2.6.9.2 | num |
| title | Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |