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IPC SM-780
Component Packaging and Interconnecting with Emphasis on Surface Mounting
Organization:
IPC - Association Connecting Electronics Industries
Year: 1988
Abstract: This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and interconnection substrates necessary for sophisticated electronic assemblies.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:17:34Z | |
| date available | 2017-09-04T17:17:34Z | |
| date copyright | 07/01/1988 | |
| date issued | 1988 | |
| identifier other | ZIMSCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/140903 | |
| description abstract | This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and interconnection substrates necessary for sophisticated electronic assemblies. | |
| language | English | |
| title | IPC SM-780 | num |
| title | Component Packaging and Interconnecting with Emphasis on Surface Mounting | en |
| type | standard | |
| page | 168 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1988 | |
| contenttype | fulltext |