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IPC TM-650 2.4.24.6
TEST METHODS MANUAL
Organization:
IPC - Association Connecting Electronics Industries
Year: 2006
Abstract: This test method establishes a procedure for determining the thermal decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA). Use of this test method for printed wiring boards or other composites may not yield comparative results.
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IPC TM-650 2.4.24.6
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:21:28Z | |
| date available | 2017-09-04T17:21:28Z | |
| date copyright | 04/01/2006 | |
| date issued | 2006 | |
| identifier other | ZTGVACAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/144695 | |
| description abstract | This test method establishes a procedure for determining the thermal decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA). Use of this test method for printed wiring boards or other composites may not yield comparative results. | |
| language | English | |
| title | IPC TM-650 2.4.24.6 | num |
| title | TEST METHODS MANUAL | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2006 | |
| contenttype | fulltext |