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Hole Location and Conductor Location

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:44:08Z
date available2017-09-04T17:44:08Z
date copyright30651
date issued1983
identifier otherEFFTCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/167158
description abstractThis is a nondestructive test that may be used at any time during the preproduction phase of printed wiring board manufacturing.
languageEnglish
titleIPC TM-650 2.2.10Anum
titleHole Location and Conductor Locationen
typestandard
page1
statusActive
treeIPC - Association Connecting Electronics Industries:;1983
contenttypefulltext


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