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IPC TM-650 2.2.10A
Hole Location and Conductor Location
Organization:
IPC - Association Connecting Electronics Industries
Year: 1983
Abstract: This is a nondestructive test that may be used at any time during the preproduction phase of printed wiring board manufacturing.
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IPC TM-650 2.2.10A
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:44:08Z | |
| date available | 2017-09-04T17:44:08Z | |
| date copyright | 30651 | |
| date issued | 1983 | |
| identifier other | EFFTCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/167158 | |
| description abstract | This is a nondestructive test that may be used at any time during the preproduction phase of printed wiring board manufacturing. | |
| language | English | |
| title | IPC TM-650 2.2.10A | num |
| title | Hole Location and Conductor Location | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1983 | |
| contenttype | fulltext |