IPC SM-817

Abstract

This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board.<br><strong>Purpose</strong><br>This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include UV or visible light, heat or ambient conditions.<br><strong>Adhesive Classification</strong><br>The classification scheme used in this standard is based on cure method.<br><em>Example</em> - IPC-SM-817/1<br>IPC-SM-817/ (specification)<br>1 (cure system) (heat)<br><strong>Adhesive Cure System</strong><br><em>Grade&#160;1</em> Heat only (IR,Convection or Conduction)<br><em>Grade 2</em> UV or visible light (with or without secondary cure mechanisms)<br><em>Grade 3</em> Ambient cure only