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IPC SM-817
General Requirements for Dielectric Surface Mounting Adhesives
Organization:
IPC - Association Connecting Electronics Industries
Year: 1989
Abstract: This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board.
Purpose
This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include UV or visible light, heat or ambient conditions.
Adhesive Classification
The classification scheme used in this standard is based on cure method.
Example - IPC-SM-817/1
IPC-SM-817/ (specification)
1 (cure system) (heat)
Adhesive Cure System
Grade 1 Heat only (IR,Convection or Conduction)
Grade 2 UV or visible light (with or without secondary cure mechanisms)
Grade 3 Ambient cure only
Purpose
This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include UV or visible light, heat or ambient conditions.
Adhesive Classification
The classification scheme used in this standard is based on cure method.
Example - IPC-SM-817/1
IPC-SM-817/ (specification)
1 (cure system) (heat)
Adhesive Cure System
Grade 1 Heat only (IR,Convection or Conduction)
Grade 2 UV or visible light (with or without secondary cure mechanisms)
Grade 3 Ambient cure only
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:45:29Z | |
| date available | 2017-09-04T17:45:29Z | |
| date copyright | 32813 | |
| date issued | 1989 | |
| identifier other | EIZGCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/168560 | |
| description abstract | This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board. Purpose This standard defines dielectric surface mounting adhesives through specification of test methods and inspection criteria. The adhesives include those intended for application by pin transfer, syringe and screening/stenciling. Cure methods include UV or visible light, heat or ambient conditions. Adhesive Classification The classification scheme used in this standard is based on cure method. Example - IPC-SM-817/1 IPC-SM-817/ (specification) 1 (cure system) (heat) Adhesive Cure System Grade 1 Heat only (IR,Convection or Conduction) Grade 2 UV or visible light (with or without secondary cure mechanisms) Grade 3 Ambient cure only | |
| language | English | |
| title | IPC SM-817 | num |
| title | General Requirements for Dielectric Surface Mounting Adhesives | en |
| type | standard | |
| page | 30 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1989 | |
| contenttype | fulltext |