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IPC TR-484
Results of IPC Copper Foil Ductility Round Robin Study
Organization:
IPC - Association Connecting Electronics Industries
Year: 1986
Abstract: Objectives and Scope
The Metalic foil Subcommitee of the Base Material Committee (formerly the Copper Foil Subcommittee of the Raw Materials Committee) decided in August 1982 to undertake a round robin test program on copper foil ductility. The objectives of this Round Robin Study were set by the Subcommittee to be:
(1) the determination of typical ductility values for the various types and classes of copper foil from different foil manufacturers;
(2) the establishment of minimum ductility requirements for the IPC-CF-150, Copper Foil for Printed Wiring Applications1
(3) the round robin testing of the fatigue ductility test method for metallic foils2 to
(a) determine critical and sensitive test method steps,and
(b) if necessary, generate the information to emphasize and elucidate any critical test method steps,
(4) the establishment of the extent to which the relationship underlying the fatigue ductility test method can be utilized to predict the high-cycle fatigue behaviour of metallic foils,and
(5) the determination of the bending fatigue behaviour of the copper foils
The Metalic foil Subcommitee of the Base Material Committee (formerly the Copper Foil Subcommittee of the Raw Materials Committee) decided in August 1982 to undertake a round robin test program on copper foil ductility. The objectives of this Round Robin Study were set by the Subcommittee to be:
(1) the determination of typical ductility values for the various types and classes of copper foil from different foil manufacturers;
(2) the establishment of minimum ductility requirements for the IPC-CF-150, Copper Foil for Printed Wiring Applications1
(3) the round robin testing of the fatigue ductility test method for metallic foils2 to
(a) determine critical and sensitive test method steps,and
(b) if necessary, generate the information to emphasize and elucidate any critical test method steps,
(4) the establishment of the extent to which the relationship underlying the fatigue ductility test method can be utilized to predict the high-cycle fatigue behaviour of metallic foils,and
(5) the determination of the bending fatigue behaviour of the copper foils
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:47:24Z | |
| date available | 2017-09-04T17:47:24Z | |
| date copyright | 04/01/1986 | |
| date issued | 1986 | |
| identifier other | EOMOCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/170602 | |
| description abstract | Objectives and Scope The Metalic foil Subcommitee of the Base Material Committee (formerly the Copper Foil Subcommittee of the Raw Materials Committee) decided in August 1982 to undertake a round robin test program on copper foil ductility. The objectives of this Round Robin Study were set by the Subcommittee to be: (1) the determination of typical ductility values for the various types and classes of copper foil from different foil manufacturers; (2) the establishment of minimum ductility requirements for the IPC-CF-150, Copper Foil for Printed Wiring Applications1 (3) the round robin testing of the fatigue ductility test method for metallic foils2 to (a) determine critical and sensitive test method steps,and (b) if necessary, generate the information to emphasize and elucidate any critical test method steps, (4) the establishment of the extent to which the relationship underlying the fatigue ductility test method can be utilized to predict the high-cycle fatigue behaviour of metallic foils,and (5) the determination of the bending fatigue behaviour of the copper foils | |
| language | English | |
| title | IPC TR-484 | num |
| title | Results of IPC Copper Foil Ductility Round Robin Study | en |
| type | standard | |
| page | 26 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1986 | |
| contenttype | fulltext |