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IPC TM-650 2.6.14D
Solder Mask - Resistance to Electrochemical Migration
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: This test method is used to determine the ability of a polymer solder mask protective coating to withstand an environment conducive to electrochemical migration.
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IPC TM-650 2.6.14D
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:54:07Z | |
| date available | 2017-09-04T17:54:07Z | |
| date copyright | 03/01/2007 | |
| date issued | 2007 | |
| identifier other | FGHVACAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/177246 | |
| description abstract | This test method is used to determine the ability of a polymer solder mask protective coating to withstand an environment conducive to electrochemical migration. | |
| language | English | |
| title | IPC TM-650 2.6.14D | num |
| title | Solder Mask - Resistance to Electrochemical Migration | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |