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IPC TM-650 2.6.3.2B
Insulation and Moisture Resistance, Flexible Base Dielectric
Organization:
IPC - Association Connecting Electronics Industries
Year: 1988
Abstract: This test method defines the procedures for determining the moisture and insulation resistance of a copper foil clad flexible dielectric material. The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of materials to the deteriorative effects of high humidity and heat conditions, typical of tropical environments.
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IPC TM-650 2.6.3.2B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:57:32Z | |
| date available | 2017-09-04T17:57:32Z | |
| date copyright | 05/01/1988 | |
| date issued | 1988 | |
| identifier other | FPDRCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/180663 | |
| description abstract | This test method defines the procedures for determining the moisture and insulation resistance of a copper foil clad flexible dielectric material. The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of materials to the deteriorative effects of high humidity and heat conditions, typical of tropical environments. | |
| language | English | |
| title | IPC TM-650 2.6.3.2B | num |
| title | Insulation and Moisture Resistance, Flexible Base Dielectric | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1988 | |
| contenttype | fulltext |