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IPC J-STD-027
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
Organization:
IPC - Association Connecting Electronics Industries
Year: 2003
Abstract: This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Purpose The purpose of this standard is to establish a family of mechanical outlines and footprints for both the device and the interconnection scheme. Interconnection ball/bump/land size, pitch, configuration, coplanarity, and associated tolerances are included in this standard.
Purpose The purpose of this standard is to establish a family of mechanical outlines and footprints for both the device and the interconnection scheme. Interconnection ball/bump/land size, pitch, configuration, coplanarity, and associated tolerances are included in this standard.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:04:44Z | |
| date available | 2017-09-04T18:04:44Z | |
| date copyright | 02/01/2003 | |
| date issued | 2003 | |
| identifier other | GHPZCBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/187634 | |
| description abstract | This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level. Purpose The purpose of this standard is to establish a family of mechanical outlines and footprints for both the device and the interconnection scheme. Interconnection ball/bump/land size, pitch, configuration, coplanarity, and associated tolerances are included in this standard. | |
| language | English | |
| title | IPC J-STD-027 | num |
| title | Mechanical Outline Standard for Flip Chip and Chip Size Configurations | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2003 | |
| contenttype | fulltext |