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IPC D-422
Design Guide for Press Fit Rigid Printed Board Backplanes
Organization:
IPC - Association Connecting Electronics Industries
Year: 1982
Abstract: Introduction
This general design guide for Printed Board Backplanes is based upon the primary understanding that the individual using this IPC document as a reference and guide has the basic mechanical knowledge of the various types of interconnection systems. Also, that the electrical and mechanical properties of the interconnection materials have already been evaluated and selected by the individual companies’ components specification organizations and are approved.
The purpose of this document is to enlarge upon the user’s analysis and approach the design from the fabricators and assemblers with respect to design optimization. This design optimization can have a dramatic impact on the life cycle cost of the equipment.
This general design guide for Printed Board Backplanes is based upon the primary understanding that the individual using this IPC document as a reference and guide has the basic mechanical knowledge of the various types of interconnection systems. Also, that the electrical and mechanical properties of the interconnection materials have already been evaluated and selected by the individual companies’ components specification organizations and are approved.
The purpose of this document is to enlarge upon the user’s analysis and approach the design from the fabricators and assemblers with respect to design optimization. This design optimization can have a dramatic impact on the life cycle cost of the equipment.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:07:59Z | |
| date available | 2017-09-04T18:07:59Z | |
| date copyright | 09/01/1982 | |
| date issued | 1982 | |
| identifier other | GQJXCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/190894 | |
| description abstract | Introduction This general design guide for Printed Board Backplanes is based upon the primary understanding that the individual using this IPC document as a reference and guide has the basic mechanical knowledge of the various types of interconnection systems. Also, that the electrical and mechanical properties of the interconnection materials have already been evaluated and selected by the individual companies’ components specification organizations and are approved. The purpose of this document is to enlarge upon the user’s analysis and approach the design from the fabricators and assemblers with respect to design optimization. This design optimization can have a dramatic impact on the life cycle cost of the equipment. | |
| language | English | |
| title | IPC D-422 | num |
| title | Design Guide for Press Fit Rigid Printed Board Backplanes | en |
| type | standard | |
| page | 27 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1982 | |
| contenttype | fulltext |