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Dimensional Inspections Using Microsections

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:09:37Z
date available2017-09-04T18:09:37Z
date copyright08/01/1997
date issued1997
identifier otherGVFSCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/192703
description abstractThis test method is to describe the procedures to be used for performing dimensional inspections on microsections of printed boards. This method does not apply to measurements less than 1.25 µm (0.00005 in). This method is intended to supersede IPC-TM-650, Methods 2.2.9 and 2.2.11.
languageEnglish
titleIPC TM-650 2.2.5Anum
titleDimensional Inspections Using Microsectionsen
typestandard
page1
statusActive
treeIPC - Association Connecting Electronics Industries:;1997
contenttypefulltext


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