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IPC TM-650 2.2.5A
Dimensional Inspections Using Microsections
Organization:
IPC - Association Connecting Electronics Industries
Year: 1997
Abstract: This test method is to describe the procedures to be used for performing dimensional inspections on microsections of printed boards. This method does not apply to measurements less than 1.25 µm (0.00005 in). This method is intended to supersede IPC-TM-650, Methods 2.2.9 and 2.2.11.
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IPC TM-650 2.2.5A
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:09:37Z | |
| date available | 2017-09-04T18:09:37Z | |
| date copyright | 08/01/1997 | |
| date issued | 1997 | |
| identifier other | GVFSCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/192703 | |
| description abstract | This test method is to describe the procedures to be used for performing dimensional inspections on microsections of printed boards. This method does not apply to measurements less than 1.25 µm (0.00005 in). This method is intended to supersede IPC-TM-650, Methods 2.2.9 and 2.2.11. | |
| language | English | |
| title | IPC TM-650 2.2.5A | num |
| title | Dimensional Inspections Using Microsections | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |