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IPC TM-650 2.4.52
Fracture Toughness of Resin Systmes for Base Materials
Organization:
IPC - Association Connecting Electronics Industries
Year: 2013
Abstract: This test method establishes a procedure for characterizing the toughness of the resin system materials used in making laminates for the fabrication of printed wiring boards. The single-edge-notch bending (SENB) geometry is used to determine the critical-stress-intensity factor, K1c, and the energy per unit area of crack surface or critical strain energy release rate, G1c, at fracture initiation. This method assumes linear elastic behavior of the cracked specimen, so there are corresponding restrictions on the linearity of the load-displacement diagram. Use of this test method for printed wiring board laminate materials or other composites may not yield comparative results.
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IPC TM-650 2.4.52
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:22:42Z | |
| date available | 2017-09-04T18:22:42Z | |
| date copyright | 2013.07.01 | |
| date issued | 2013 | |
| identifier other | ICFMKFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/205161 | |
| description abstract | This test method establishes a procedure for characterizing the toughness of the resin system materials used in making laminates for the fabrication of printed wiring boards. The single-edge-notch bending (SENB) geometry is used to determine the critical-stress-intensity factor, K1c, and the energy per unit area of crack surface or critical strain energy release rate, G1c, at fracture initiation. This method assumes linear elastic behavior of the cracked specimen, so there are corresponding restrictions on the linearity of the load-displacement diagram. Use of this test method for printed wiring board laminate materials or other composites may not yield comparative results. | |
| language | English | |
| title | IPC TM-650 2.4.52 | num |
| title | Fracture Toughness of Resin Systmes for Base Materials | en |
| type | standard | |
| page | 8 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2013 | |
| contenttype | fulltext |