IPC 2316

Design Guide for Embedded Passive Device Printed Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T18:31:16Z
date available	2017-09-04T18:31:16Z
date copyright	03/01/2007
date issued	2007
identifier other	IYGNZBAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/213455
description abstract	Statement of Scope This document is a guide to established and emerging embedded passive materials and technologies. It should not be used as an endorsement of any particular material or company product. Purpose The purpose of this document is to give users and designers of printed boards the necessary information for incorporating embedded passive components into their applications. In addition, it also assists the user in understanding some of the physical and thermal characteristics of the embedded component materials so that their designs can achieve maximum stability and performance.
language	English
title	IPC 2316	num
title	Design Guide for Embedded Passive Device Printed Boards	en
type	standard
page	64
status	Active
tree	IPC - Association Connecting Electronics Industries:;2007
contenttype	fulltext