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IPC 2316
Design Guide for Embedded Passive Device Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: Statement of Scope This document is a guide to established and emerging embedded passive materials and technologies. It should not be used as an endorsement of any particular material or company product.
Purpose The purpose of this document is to give users and designers of printed boards the necessary information for incorporating embedded passive components into their applications. In addition, it also assists the user in understanding some of the physical and thermal characteristics of the embedded component materials so that their designs can achieve maximum stability and performance.
Purpose The purpose of this document is to give users and designers of printed boards the necessary information for incorporating embedded passive components into their applications. In addition, it also assists the user in understanding some of the physical and thermal characteristics of the embedded component materials so that their designs can achieve maximum stability and performance.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:31:16Z | |
| date available | 2017-09-04T18:31:16Z | |
| date copyright | 03/01/2007 | |
| date issued | 2007 | |
| identifier other | IYGNZBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/213455 | |
| description abstract | Statement of Scope This document is a guide to established and emerging embedded passive materials and technologies. It should not be used as an endorsement of any particular material or company product. Purpose The purpose of this document is to give users and designers of printed boards the necessary information for incorporating embedded passive components into their applications. In addition, it also assists the user in understanding some of the physical and thermal characteristics of the embedded component materials so that their designs can achieve maximum stability and performance. | |
| language | English | |
| title | IPC 2316 | num |
| title | Design Guide for Embedded Passive Device Printed Boards | en |
| type | standard | |
| page | 64 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |