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IPC TM-650 2.2.14.1
Solder Powder Particle Size Distribution - Measuring Microscope Method
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This test specifies a standard procedure for estimating the particle size and the particle shape of solder powder in solder pastes by microscopic methods.
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IPC TM-650 2.2.14.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:34:31Z | |
| date available | 2017-09-04T18:34:31Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | JGTOCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/216700 | |
| description abstract | This test specifies a standard procedure for estimating the particle size and the particle shape of solder powder in solder pastes by microscopic methods. | |
| language | English | |
| title | IPC TM-650 2.2.14.1 | num |
| title | Solder Powder Particle Size Distribution - Measuring Microscope Method | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |