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IPC TM-650 2.6.7.3
Thermal Shock - Solder Mask
Organization:
IPC - Association Connecting Electronics Industries
Year: 2000
Abstract: This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.
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IPC TM-650 2.6.7.3
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:36:27Z | |
| date available | 2017-09-04T18:36:27Z | |
| date copyright | 07/01/2000 | |
| date issued | 2000 | |
| identifier other | JLCGQAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=authoF2376596FCDCAC426159DD6E273C9FCD/handle/yse/218366 | |
| description abstract | This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue. | |
| language | English | |
| title | IPC TM-650 2.6.7.3 | num |
| title | Thermal Shock - Solder Mask | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2000 | |
| contenttype | fulltext |