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Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)
ASTM F72-21
Organization:
ASTM - ASTM International
Year: 2024
Abstract: This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests.
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Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)
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| contributor author | ASTM - ASTM International | |
| date accessioned | 2024-12-17T23:29:02Z | |
| date available | 2024-12-17T23:29:02Z | |
| date copyright | 2024 | |
| date issued | 2024 | |
| identifier other | f0072-21.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessionid=190419C4AB017808E65B78A0B48BF7AE/handle/yse/337863 | |
| description abstract | This specification covers round drawn/extruded gold wires for internal semiconductor device electrical connections. The wires are available in four classifications, namely: copper-modified wire, beryllium-modified wire, high-strength wire, and special purpose wire. Aptly sampled wires shall be examined by test methods suggested herein, and each class shall conform correspondingly to specified requirements for chemical composition, mechanical properties (breaking load and elongation), dimension (diameter and weight), and workmanship and finish. The wires shall also undergo wire curl, wire axial twist, and wire roundness tests. | |
| language | English | |
| title | Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024) | en |
| title | ASTM F72-21 | num |
| type | standard | |
| page | 11 | |
| status | Historical | |
| tree | ASTM - ASTM International:;2024 | |
| contenttype | fulltext | |
| scope | 1.1 This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire. Note 1: Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as “modifying,” “stabilizing,” or “doping.” The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, “high-strength” and “special purpose” wire, the identity of modifying additives is not restricted. 1.2 The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard. 1.3 The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. | |
| identifier DOI | 10.1520/F0072-21 |