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IPC 1601
Printed Board Handling and Storage Guidelines
Organization:
IPC - Association Connecting Electronics Industries
Year: 2010
Abstract: This document provides suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. These guidelines are intended to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge (ESD) (when necessary), and moisture uptake. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases, the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. This is especially challenging with the higher temperatures used for lead-free soldering.
This document covers all phases from the manufacture of the bare printed board, through delivery, receiving, stocking, assembly, and soldering. As a guideline, this information is to be used with, and is secondary to, the established requirements in such documents as the IPC-4550 series for alternate final finishes.
This document covers all phases from the manufacture of the bare printed board, through delivery, receiving, stocking, assembly, and soldering. As a guideline, this information is to be used with, and is secondary to, the established requirements in such documents as the IPC-4550 series for alternate final finishes.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:08:18Z | |
| date available | 2017-09-04T17:08:18Z | |
| date copyright | 08/01/2010 | |
| date issued | 2010 | |
| identifier other | YKBVYCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessionid=22E9669814B1A2CD62B816A309F4CAB6/handle/yse/131840 | |
| description abstract | This document provides suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. These guidelines are intended to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge (ESD) (when necessary), and moisture uptake. Moisture absorbed in printed board laminates expands at soldering temperatures, and in some cases, the resulting vapor pressure can cause internal delamination or excessive strain on plated-hole walls and other structures. This is especially challenging with the higher temperatures used for lead-free soldering. This document covers all phases from the manufacture of the bare printed board, through delivery, receiving, stocking, assembly, and soldering. As a guideline, this information is to be used with, and is secondary to, the established requirements in such documents as the IPC-4550 series for alternate final finishes. | |
| language | English | |
| title | IPC 1601 | num |
| title | Printed Board Handling and Storage Guidelines | en |
| type | standard | |
| page | 28 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2010 | |
| contenttype | fulltext |