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English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-506: General test methods for materials and assemblies – An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501 - Edition 1.0
IEC TR 61189-5-506
Organization:
IEC - International Electrotechnical Commission
Year: 2019
Abstract: Scope: This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-μm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 μm and 500 μm.
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English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-506: General test methods for materials and assemblies – An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501 - Edition 1.0
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| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2020-09-15T22:28:38Z | |
| date available | 2020-09-15T22:28:38Z | |
| date copyright | 2019.06.01 | |
| date issued | 2019 | |
| identifier other | XJHEIGAAAAAAAAAA.pdf | |
| identifier other | XJHEIGAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessionid=A671ED4E01C6F65EDA291C18A55663AF/handle/yse/289076 | |
| description abstract | Scope: This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-μm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 μm and 500 μm. | |
| language | English | |
| title | English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-506: General test methods for materials and assemblies – An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501 - Edition 1.0 | en |
| title | IEC TR 61189-5-506 | num |
| type | standard | |
| page | 28 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2019 | |
| contenttype | fulltext |