ECA CB 5

Recommended Test Procedure for Semiconductor Thermal Dissipating Devices

contributor author	ECIA - Electronic Components Industry Association
date accessioned	2017-09-04T16:45:20Z
date available	2017-09-04T16:45:20Z
date copyright	07/01/1969
date issued	1969
identifier other	BTAPCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsessionid=BBE8185F4818DB884166C94D350F130D/handle/yse/108612
description abstract	This test procedure provides standard methods for the evaluation of semiconductor thermal dissipators. Purpose: The purpose of this Bulletin is to establish standard procedures for the evaluation, calibration, and presentation of test data for semiconductor thermal dissipators. Since semiconductor and thermal dissipator temperature measurements are meaningless when test conditions are not uniform or controlled, this test procedure will define the methods for testing and presenting data on temperature measurements of semiconductor junction, semiconductor case, chassis, thermal dissipator, and ambient under both natural and forced convection environments. Nomenclature : The commonly used and incorrect term "heat sink" refers in practice to "heat" or "thermal" dissipators used to reduce the operating case temperature of a semiconductor by transferring heat t o an ambient fluid.
language	English
title	ECA CB 5	num
title	Recommended Test Procedure for Semiconductor Thermal Dissipating Devices	en
type	standard
page	17
status	Active
tree	ECIA - Electronic Components Industry Association:;1969
contenttype	fulltext