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ECA CB 5
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
Organization:
ECIA - Electronic Components Industry Association
Year: 1969
Abstract: This test procedure provides standard methods for the evaluation of semiconductor thermal dissipators.
Purpose:
The purpose of this Bulletin is to establish standard procedures for the evaluation, calibration, and presentation of test data for semiconductor thermal dissipators. Since semiconductor and thermal dissipator temperature measurements are meaningless when test conditions are not uniform or controlled, this test procedure will define the methods for testing and presenting data on temperature measurements of semiconductor junction, semiconductor case, chassis, thermal dissipator, and ambient under both natural and forced convection environments.
Nomenclature :
The commonly used and incorrect term "heat sink" refers in practice to "heat" or "thermal" dissipators used to reduce the operating case temperature of a semiconductor by transferring heat t o an ambient fluid.
Purpose:
The purpose of this Bulletin is to establish standard procedures for the evaluation, calibration, and presentation of test data for semiconductor thermal dissipators. Since semiconductor and thermal dissipator temperature measurements are meaningless when test conditions are not uniform or controlled, this test procedure will define the methods for testing and presenting data on temperature measurements of semiconductor junction, semiconductor case, chassis, thermal dissipator, and ambient under both natural and forced convection environments.
Nomenclature :
The commonly used and incorrect term "heat sink" refers in practice to "heat" or "thermal" dissipators used to reduce the operating case temperature of a semiconductor by transferring heat t o an ambient fluid.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:45:20Z | |
| date available | 2017-09-04T16:45:20Z | |
| date copyright | 07/01/1969 | |
| date issued | 1969 | |
| identifier other | BTAPCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessionid=BBE8185F4818DB884166C94D350F130D/handle/yse/108612 | |
| description abstract | This test procedure provides standard methods for the evaluation of semiconductor thermal dissipators. Purpose: The purpose of this Bulletin is to establish standard procedures for the evaluation, calibration, and presentation of test data for semiconductor thermal dissipators. Since semiconductor and thermal dissipator temperature measurements are meaningless when test conditions are not uniform or controlled, this test procedure will define the methods for testing and presenting data on temperature measurements of semiconductor junction, semiconductor case, chassis, thermal dissipator, and ambient under both natural and forced convection environments. Nomenclature : The commonly used and incorrect term "heat sink" refers in practice to "heat" or "thermal" dissipators used to reduce the operating case temperature of a semiconductor by transferring heat t o an ambient fluid. | |
| language | English | |
| title | ECA CB 5 | num |
| title | Recommended Test Procedure for Semiconductor Thermal Dissipating Devices | en |
| type | standard | |
| page | 17 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1969 | |
| contenttype | fulltext |