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ECA CB 5-1
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices - Addendum to CB5
Organization:
ECIA - Electronic Components Industry Association
Year: 1971
Abstract: The scope of this supplement to EIA Components Bulletin No. 5 is to present methods of instrumentation for plastic case semiconductors and integrated circuits for evaluation of thermal dissipating devices.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T16:53:01Z | |
| date available | 2017-09-04T16:53:01Z | |
| date copyright | 05/01/1971 | |
| date issued | 1971 | |
| identifier other | WUJRCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessionid=BBE8185F4818DB884166C94D350F130D/handle/yse/116412 | |
| description abstract | The scope of this supplement to EIA Components Bulletin No. 5 is to present methods of instrumentation for plastic case semiconductors and integrated circuits for evaluation of thermal dissipating devices. | |
| language | English | |
| title | ECA CB 5-1 | num |
| title | Recommended Test Procedure for Semiconductor Thermal Dissipating Devices - Addendum to CB5 | en |
| type | standard | |
| page | 14 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;1971 | |
| contenttype | fulltext |