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IPC J-STD-005 JAPANESE
English -- Requirements for Soldering Pastes - Incorporates Amendment 1: June 1996;
Japanese -- はんだペースト⽤ 要求事項 - Incorporates Amendment 1: June 1996
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
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IPC J-STD-005 JAPANESE
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:49:31Z | |
| date available | 2017-09-04T18:49:31Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | KRWUFCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouth=179893FDFCDCAC4/handle/yse/230838 | |
| description abstract | This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. | |
| language | Japanese | |
| title | IPC J-STD-005 JAPANESE | num |
| title | English -- Requirements for Soldering Pastes - Incorporates Amendment 1: June 1996 | en |
| title | Japanese -- はんだペースト⽤ 要求事項 - Incorporates Amendment 1: June 1996 | other |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |