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IPC 4556 AMD 1
English -- Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2016
Abstract: There is no abstract information for this document.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-10-18T10:59:00Z | |
| date available | 2017-10-18T10:59:00Z | |
| date copyright | 2016.01.01 | |
| date issued | 2016 | |
| identifier other | KLOPOFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouth=179893FDFCDCAC4/handle/yse/233271 | |
| description abstract | There is no abstract information for this document. | |
| language | English | |
| title | IPC 4556 AMD 1 | num |
| title | English -- Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards | en |
| type | standard | |
| page | 9 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2016 | |
| contenttype | fulltext |