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IPC TM-650 2.3.31

Relative Degree of Cure in U.V. Curable Materials

Organization:
IPC - Association Connecting Electronics Industries
Year: 1988

Abstract: This test method is designed to determine relative degree of cure in liquid U.V. curable materials such as etch resists, plating resists and solder masks. It is not applicable to dry film products nor to solvent-based thermal cure products.
URI: http://yse.yabesh.ir/std;jsessioutho1513AF67081D20686159DD6EFDEC014A/handle/yse/141497
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    IPC TM-650 2.3.31

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:18:09Z
date available2017-09-04T17:18:09Z
date copyright02/01/1988
date issued1988
identifier otherZKDJCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessioutho1513AF67081D20686159DD6EFDEC014A/handle/yse/141497
description abstractThis test method is designed to determine relative degree of cure in liquid U.V. curable materials such as etch resists, plating resists and solder masks. It is not applicable to dry film products nor to solvent-based thermal cure products.
languageEnglish
titleIPC TM-650 2.3.31num
titleRelative Degree of Cure in U.V. Curable Materialsen
typestandard
page2
statusActive
treeIPC - Association Connecting Electronics Industries:;1988
contenttypefulltext
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