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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 141-160 of 793
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IPC J-STD-006B JAPANESE
Abstract: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ... -
IPC FC-234A
Abstract: This document provides guidelines for the use of PSAs in single or double sided flexible printed circuits (see Figures A2 through A8), membrane switches (see Figures A9 through A12) and component attachments (see Figures ... -
IPC TM-650 2.5.33.1
Abstract: This test method describes the measurement of the DC tip-to-ground resistance of an electric hand soldering/ desoldering tool designed with a grounded tip. Measurement of tip-to-ground AC reactance is outside the scope of ... -
IPC 2223C
Abstract: This standard establishes the specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures ... -
IPC TA-724
Abstract: Overview
The continuing trend to finer features on PCBs increased the negative effect of particles on board yields. Cleanrooms provide a logical way to reduce the effect of particles, and are more ... -
IPC 6013B
Abstract: Statement of Scope This specification covers qualification and performance requirements of flexible printed boards (PBs). The flexible PB may be single-sided, doublesided, multilayer, or rigid-flex multilayer. ... -
IPC 4130
Abstract: This specification covers mat made from nonwoven ‘‘E'' glass fibers intended as a reinforcing material in laminated plastics for electrical and electronic use.
Purpose This specification ... -
IPC TM-650 2.1.1F
Abstract: This method is to be used as a guideline for preparing a metallographic specimen of printed boards. The finished microsection is used for evaluating the quality of the laminate system and plated structures (plated-through ... -
IPC TR-467
Abstract: During the kickoff meeting at San Diego for this task group (5/l/95), a vote was taken to determine if the attendees (some 26 members of industry) felt that a revision to the existing appendix D was needed. The group voted ... -
IPC 2515A
Abstract: This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed circuit board designers and printed board ... -
IPC TM-650 2.6.7.2B
Abstract: This method is to determine the physical endurance of printed boards to sudden changes of temperature. It is designed to expose specimens to a series of high and low temperature excursions to cause physical fatigue. -
IPC TM-650 2.5.5.13
Abstract: This method describes the nondestructive measurement of the relative permittivity and loss tangent of unclad dielectric substrates at microwave frequencies using a splitcylinder resonator (see Figure 1). This test ... -
IPC NC-349
Abstract: This standard defines a machine readable input format for Computer Numerical Control (CNC) drilling and routing machine tools related to the printed wiring board industry.
The format may be used directly to transfer ... -
IPC TM-650 2.4.49
Abstract: This solder pool test method provides a measurement of wetting characteristics of flux on/in flux-coated and/or flux-cored solder. -
IPC TM-650 2.4.36C
Abstract: This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel and conductor ... -
IPC TM-650 2.3.4.2A
Abstract: This method is designed to evaluate the resistance of dielectric materials to organic chemicals representative of those used in printed board fabrication and assembly. It is intended to provide a distinction between ...