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IPC J-STD-006B JAPANESE
English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications;
Japanese -- 電⼦グレードソル ダー合⾦および電⼦ はんだ付け⽤流体化 および⾮流体化ソリ ッドソルダーに 関する要求事項
Organization:
IPC - Association Connecting Electronics Industries
Year: 2006
Abstract: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for “special” electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32.
This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry:
IPC/EIA J-STD-004 Requirements for Soldering Fluxes
IPC/EIA J-STD-005 Requirements for Soldering Pastes
IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.Intended Use: This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.
This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry:
IPC/EIA J-STD-004 Requirements for Soldering Fluxes
IPC/EIA J-STD-005 Requirements for Soldering Pastes
IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.Intended Use: This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.
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IPC J-STD-006B JAPANESE
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:18:32Z | |
| date available | 2017-09-04T18:18:32Z | |
| date copyright | 01/01/2006 | |
| date issued | 2006 | |
| identifier other | HRWUFCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessioutho1513AF67081D20686159DD6EFDEC014A/handle/yse/201319 | |
| description abstract | This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for “special” electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards the prescribe the requirements and test methods for soldering materials for use in the electronics industry: IPC/EIA J-STD-004 Requirements for Soldering Fluxes IPC/EIA J-STD-005 Requirements for Soldering Pastes IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.Intended Use: This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. | |
| language | Japanese | |
| title | IPC J-STD-006B JAPANESE | num |
| title | English -- Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications | en |
| title | Japanese -- 電⼦グレードソル ダー合⾦および電⼦ はんだ付け⽤流体化 および⾮流体化ソリ ッドソルダーに 関する要求事項 | other |
| type | standard | |
| page | 30 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2006 | |
| contenttype | fulltext |