Now showing items 201-220 of 793

    • IPC TM-650 2.3.23B 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1988
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This test method covers the cure, or permanence, testing of thermally cured solder mask (solder resist) organic coatings. Solder masking is the application of either a liquid film or dry film coating on all types of laminates ...
    • IPC 1710A 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2004
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: FOREWORD
      It is not intended that this Manufacturers’ Qualification Profile (MQP) satisfies all the requirements of the customer, however, conscientious maintenance of this document and or ...
    • IPC TM-650 2.1.1E 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2004
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This procedure is to be used for preparing a metallographic specimen of printed wiring products. The finished microsection is used for evaluating the quality of the laminate system and the plated-through holes (PTHs). The ...
    • IPC IPC/JEDEC-9702 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2004
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification ...
    • IPC JP002 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2006
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. ...
    • IPC TM-650 2.6.10A 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1997
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This non-destructive inspection method is needed to ascertain the following conditions:
      a. Innerlayer shift is within acceptable tolerances.
      b. One or more inner layers have not been reversed.
      c. Drilled holes ...
    • IPC TM-650 2.4.12A 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1991
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This method is used to determine the solderability of copper foil, copper clad laminate, and printed boards. This method does not specifically relate to the solderability of the internal plating in holes.
    • IPC TM-650 2.4.24.1 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1994
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This method describes the method for determining the time to delamination of laminates and printed boards through the use of a thermomechanical analyzer (TMA).
    • IPC TA-720 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1986
      Organization : IPC - Association Connecting Electronics Industries
    • IPC TR-551 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1993
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: Foreword
      This document is a compendium of technical methods and techniques used for evaluating the quality aspects of present and future interconnection products and electronic assemblies.
      There ...
    • IPC TM-650 2.2.20 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1995
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This procedure determines the percent metal content for solder paste.
    • IPC TM-650 2.6.3.2B 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1988
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This test method defines the procedures for determining the moisture and insulation resistance of a copper foil clad flexible dielectric material. The moisture resistance test is performed for the purpose of evaluating, ...
    • IPC TM-650 2.4.31A 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1986
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This method describes the test procedure required to perform the folding test for flexible flat cable.
    • IPC TM-650 2.4.22.2 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1995
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This test method establishes a procedure for determining the flatness of silicon wafers coated with deposited organic films.
    • IPC SG-141 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;1992
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This specification covers finished fabrics woven from "S" Glass Electrical Grade Glass Fiber, yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use.
    • IPC 4761 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2006
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: The protection of through vias within PrintedWiring Boards (PWB) has evolved from limited use to common practice. Technology has evolved where via fabrication techniques and protection methodologies need to be defined to ...
    • IPC TM-650 2.6.2D 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2012
      Organization : IPC - Association Connecting Electronics Industries
    • IPC TM-650 2.6.14D 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2007
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This test method is used to determine the ability of a polymer solder mask protective coating to withstand an environment conducive to electrochemical migration.
    • IPC 2571 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2001
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: The Product Data eXchange 1.0 standard defines an XML encoding scheme that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The scheme is defined for bill ...
    • IPC 9261A 

      Type: standard
      Source: IPC - Association Connecting Electronics Industries:;2006
      Organization : IPC - Association Connecting Electronics Industries
      Abstract: This document defines standard methodologies for calculating defects per million opportunities (DPMO) metrics related to electronic printed board assembly processes. It is intended for use in measuring in-process assembly ...