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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 201-220 of 793
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IPC TM-650 2.3.23B
Abstract: This test method covers the cure, or permanence, testing of thermally cured solder mask (solder resist) organic coatings. Solder masking is the application of either a liquid film or dry film coating on all types of laminates ... -
IPC 1710A
Abstract: FOREWORD
It is not intended that this Manufacturers’ Qualification Profile (MQP) satisfies all the requirements of the customer, however, conscientious maintenance of this document and or ... -
IPC TM-650 2.1.1E
Abstract: This procedure is to be used for preparing a metallographic specimen of printed wiring products. The finished microsection is used for evaluating the quality of the laminate system and the plated-through holes (PTHs). The ... -
IPC IPC/JEDEC-9702
Abstract: This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification ... -
IPC JP002
Abstract: This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. ... -
IPC TM-650 2.6.10A
Abstract: This non-destructive inspection method is needed to ascertain the following conditions:
a. Innerlayer shift is within acceptable tolerances.
b. One or more inner layers have not been reversed.
c. Drilled holes ... -
IPC TM-650 2.4.12A
Abstract: This method is used to determine the solderability of copper foil, copper clad laminate, and printed boards. This method does not specifically relate to the solderability of the internal plating in holes. -
IPC TM-650 2.4.24.1
Abstract: This method describes the method for determining the time to delamination of laminates and printed boards through the use of a thermomechanical analyzer (TMA). -
IPC TR-551
Abstract: Foreword
This document is a compendium of technical methods and techniques used for evaluating the quality aspects of present and future interconnection products and electronic assemblies.
There ... -
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IPC TM-650 2.6.3.2B
Abstract: This test method defines the procedures for determining the moisture and insulation resistance of a copper foil clad flexible dielectric material. The moisture resistance test is performed for the purpose of evaluating, ... -
IPC TM-650 2.4.31A
Abstract: This method describes the test procedure required to perform the folding test for flexible flat cable. -
IPC TM-650 2.4.22.2
Abstract: This test method establishes a procedure for determining the flatness of silicon wafers coated with deposited organic films. -
IPC SG-141
Abstract: This specification covers finished fabrics woven from "S" Glass Electrical Grade Glass Fiber, yarns that are intended as a reinforcing material in laminated plastics for electrical and electronic use. -
IPC 4761
Abstract: The protection of through vias within PrintedWiring Boards (PWB) has evolved from limited use to common practice. Technology has evolved where via fabrication techniques and protection methodologies need to be defined to ... -
IPC TM-650 2.6.14D
Abstract: This test method is used to determine the ability of a polymer solder mask protective coating to withstand an environment conducive to electrochemical migration. -
IPC 2571
Abstract: The Product Data eXchange 1.0 standard defines an XML encoding scheme that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The scheme is defined for bill ... -
IPC 9261A
Abstract: This document defines standard methodologies for calculating defects per million opportunities (DPMO) metrics related to electronic printed board assembly processes. It is intended for use in measuring in-process assembly ...