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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 221-240 of 793
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IPC TM-650 2.3.17.2B
Abstract: This test method is designed to measure the Resin Flow of "no flow" prepreg used for bonding and adhesion without formation of resin bead as caused by flow of the resin. -
IPC IPC/JEDEC-9704A
Abstract: This document is meant to be used as a methodology for strain gage placement and subsequent testing of Printed Circuit Assemblies (PCAs) using strain gages. The method describes specific guidelines for strain gage testing ... -
IPC TM-650 2.4.7.1
Abstract: This test method specifies techniques for the determination of machineability of a solder mask. -
IPC 9252A
Abstract: This document is presented to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards without embedded components (i.e., ... -
IPC TM-650 2.3.21A
Abstract: The Hull Cell is a miniature plating unit designed to produce cathode deposits on a panel that correlates the characteristics of the plating unit being evaluated. Interpretation of the ‘‘as plated'' cathode ... -
IPC TM-650 2.3.28.1
Abstract: This test procedure is designed to measure the level of chloride, bromide, and fluoride present in a soldering flux or paste by Ion Chromatography. -
IPC IPC/JEDEC J-STD-609A
Abstract: This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This standard describes the marking of components and the labeling of their shipping containers to identify ... -
IPC 2221A CHINESE
Abstract: This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, reinforced, or used ... -
IPC 9701A
Abstract: This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and ... -
IPC 2225
Abstract: This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination ... -
IPC 6018B
Abstract: This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, ... -
IPC TM-650 2.4.9.1
Abstract: The purpose of this test is to characterize peel adhesion at ambient conditions. -
IPC 2226
Abstract: This standard establishes requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and its forms of component mounting and interconnecting structures.IPC TM-650 2.4.42.3
Abstract: The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisition document. This test may be applied ...IPC TR-484
Abstract: Objectives and Scope
The Metalic foil Subcommitee of the Base Material Committee (formerly the Copper Foil Subcommittee of the Raw Materials Committee) decided in August 1982 to undertake a round robin ...