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IPC TM-650 2.3.2G
Chemical Resistance of Flexible Printed Board Materials
Organization:
IPC - Association Connecting Electronics Industries
Year: 2007
Abstract: To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The person implementing this test method should refer to the appropriate Material Safety Data Sheet or equivalent for each chemical for safe operation.
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IPC TM-650 2.3.2G
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:22:31Z | |
| date available | 2017-09-04T18:22:31Z | |
| date copyright | 39417 | |
| date issued | 2007 | |
| identifier other | IBOJGCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessioutho1513AF67081D20686159DD6EFDEC014A/handle/yse/204931 | |
| description abstract | To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The person implementing this test method should refer to the appropriate Material Safety Data Sheet or equivalent for each chemical for safe operation. | |
| language | English | |
| title | IPC TM-650 2.3.2G | num |
| title | Chemical Resistance of Flexible Printed Board Materials | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |