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IPC TM-650 2.3.7.2A
Alkaline Etching Method
Organization:
IPC - Association Connecting Electronics Industries
Year: 1994
Abstract: This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using an alkaline etching solution for removal of copper cladding.
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IPC TM-650 2.3.7.2A
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:32:49Z | |
| date available | 2017-09-04T18:32:49Z | |
| date copyright | 34669 | |
| date issued | 1994 | |
| identifier other | JCHWCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessioutho1513AF67081D20686159DD6EFDEC014A/handle/yse/214993 | |
| description abstract | This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using an alkaline etching solution for removal of copper cladding. | |
| language | English | |
| title | IPC TM-650 2.3.7.2A | num |
| title | Alkaline Etching Method | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1994 | |
| contenttype | fulltext |