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IPC 0040
Optoelectronics Assembly and Packaging Technology
Organization:
IPC - Association Connecting Electronics Industries
Year: 2003
Abstract: This document addresses the implementation of optical and optoelectronic packaging technologies.
The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.
Purpose
This document is intended to provide general information on implementing optical and optoelectronic packaging technologies, for creating component mounting structures and assemblies that may be exclusively optically oriented or that are to perform a combination of optical and electronic functions.
The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.
Purpose
This document is intended to provide general information on implementing optical and optoelectronic packaging technologies, for creating component mounting structures and assemblies that may be exclusively optically oriented or that are to perform a combination of optical and electronic functions.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:10:01Z | |
| date available | 2017-09-04T15:10:01Z | |
| date copyright | 05/01/2003 | |
| date issued | 2003 | |
| identifier other | LPWODBAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessioutho1513AF67081D20686159DD6EFDEC014A/handle/yse/8220 | |
| description abstract | This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly. Purpose This document is intended to provide general information on implementing optical and optoelectronic packaging technologies, for creating component mounting structures and assemblies that may be exclusively optically oriented or that are to perform a combination of optical and electronic functions. | |
| language | English | |
| title | IPC 0040 | num |
| title | Optoelectronics Assembly and Packaging Technology | en |
| type | standard | |
| page | 176 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2003 | |
| contenttype | fulltext |