JEDEC JESD51-11

Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T17:45:47Z
date available	2017-09-04T17:45:47Z
date copyright	06/01/2001
date issued	2001
identifier other	EJZYPAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsessioutho9279AF67081DAC4/handle/yse/168944
description abstract	This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-11 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.
language	English
title	JEDEC JESD51-11	num
title	Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements	en
type	standard
page	18
status	Active
tree	JEDEC - Solid State Technology Association:;2001
contenttype	fulltext
subject keywords	PGA
subject keywords	Test Board
subject keywords	Thermal Test
subject keywords	Through-Hole Packages