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JEDEC JESD51-11
Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements
Organization:
JEDEC - Solid State Technology Association
Year: 2001
Abstract: This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-11 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.
Subject: PGA
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JEDEC JESD51-11
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T17:45:47Z | |
| date available | 2017-09-04T17:45:47Z | |
| date copyright | 06/01/2001 | |
| date issued | 2001 | |
| identifier other | EJZYPAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessioutho9279AF67081DAC4/handle/yse/168944 | |
| description abstract | This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-11 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families. | |
| language | English | |
| title | JEDEC JESD51-11 | num |
| title | Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements | en |
| type | standard | |
| page | 18 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2001 | |
| contenttype | fulltext | |
| subject keywords | PGA | |
| subject keywords | Test Board | |
| subject keywords | Thermal Test | |
| subject keywords | Through-Hole Packages |