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IEC TS 61189-3-301
English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies ? Part 3-301: Test methods for interconnection structures (printed boards) ? Appearance inspection method for plated surfaces on PWB - Edition 1.0
| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2017-10-18T11:07:17Z | |
| date available | 2017-10-18T11:07:17Z | |
| date copyright | 2016.07.01 | |
| date issued | 2016 | |
| identifier other | UFSZQFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/235256 | |
| description abstract | Scope: This part of IEC 61189 outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs. | |
| language | English | |
| title | IEC TS 61189-3-301 | num |
| title | English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies ? Part 3-301: Test methods for interconnection structures (printed boards) ? Appearance inspection method for plated surfaces on PWB - Edition 1.0 | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2016 | |
| contenttype | fulltext |
