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IEC TS 61189-3-301

English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies ? Part 3-301: Test methods for interconnection structures (printed boards) ? Appearance inspection method for plated surfaces on PWB - Edition 1.0

Organization:
IEC - International Electrotechnical Commission
Year: 2016

Abstract: Scope: This part of IEC 61189 outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.
URI: http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/235256
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    IEC TS 61189-3-301

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contributor authorIEC - International Electrotechnical Commission
date accessioned2017-10-18T11:07:17Z
date available2017-10-18T11:07:17Z
date copyright2016.07.01
date issued2016
identifier otherUFSZQFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/235256
description abstractScope: This part of IEC 61189 outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.
languageEnglish
titleIEC TS 61189-3-301num
titleEnglish -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies ? Part 3-301: Test methods for interconnection structures (printed boards) ? Appearance inspection method for plated surfaces on PWB - Edition 1.0en
typestandard
page20
statusActive
treeIEC - International Electrotechnical Commission:;2016
contenttypefulltext
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