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IEC TR 61189-3-914
English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies ? Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs ? Guidelines - Edition 1.0
Organization:
IEC - International Electrotechnical Commission
Year: 2017
Abstract: Scope: This document specifies the detailed procedures and precautions for IEC 61189-3-913.
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IEC TR 61189-3-914
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| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2017-10-18T11:07:43Z | |
| date available | 2017-10-18T11:07:43Z | |
| date copyright | 2017.03.01 | |
| date issued | 2017 | |
| identifier other | USFHYFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/235367 | |
| description abstract | Scope: This document specifies the detailed procedures and precautions for IEC 61189-3-913. | |
| language | English | |
| title | IEC TR 61189-3-914 | num |
| title | English -- Test methods for electrical materials, printed boards and other interconnection structures and assemblies ? Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs ? Guidelines - Edition 1.0 | en |
| type | standard | |
| page | 28 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2017 | |
| contenttype | fulltext |