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IEC 60068-2-69
English -- Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method - Edition 3.0;
French -- Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilit‚ des composants ‚lectroniques et cartes imprim‚es par la m‚thode de la balance de mouillage (mesure de la force) - Edition 3.0
Organization:
IEC - International Electrotechnical Commission
Year: 2017
Abstract: Scope: This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).
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| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2017-10-18T11:09:16Z | |
| date available | 2017-10-18T11:09:16Z | |
| date copyright | 2017.03.01 | |
| date issued | 2017 | |
| identifier other | CGPCYFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/235695 | |
| description abstract | Scope: This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). | |
| language | English, French | |
| title | IEC 60068-2-69 | num |
| title | English -- Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method - Edition 3.0 | en |
| title | French -- Essais d'environnement - Partie 2-69: Essais - Essai Te/Tc: Essai de brasabilit‚ des composants ‚lectroniques et cartes imprim‚es par la m‚thode de la balance de mouillage (mesure de la force) - Edition 3.0 | other |
| type | standard | |
| page | 114 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2017 | |
| contenttype | fulltext |