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IEC TR 63072-1

English -- Photonic integrated circuits - Part 1: Introduction and roadmap for standardization IEC - Edition 1.0

Organization:
IEC - International Electrotechnical Commission
Year: 2017

Abstract: Scope: This part of IEC 63072, which is a Technical Report, provides an introduction to photonic integrated circuits (PICs) and describes a roadmap for the standardization of PIC technology over the next decade NOTE The trademarks and trade names mentioned in this document are given for the convenience of users of this document; this does not constitute an endorsement by IEC of these companies
URI: http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/236370
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    IEC TR 63072-1

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contributor authorIEC - International Electrotechnical Commission
date accessioned2017-10-18T11:12:09Z
date available2017-10-18T11:12:09Z
date copyright2017.05.01
date issued2017
identifier otherZWFAZFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/236370
description abstractScope: This part of IEC 63072, which is a Technical Report, provides an introduction to photonic integrated circuits (PICs) and describes a roadmap for the standardization of PIC technology over the next decade NOTE The trademarks and trade names mentioned in this document are given for the convenience of users of this document; this does not constitute an endorsement by IEC of these companies
languageEnglish
titleIEC TR 63072-1num
titleEnglish -- Photonic integrated circuits - Part 1: Introduction and roadmap for standardization IEC - Edition 1.0en
typestandard
page50
statusActive
treeIEC - International Electrotechnical Commission:;2017
contenttypefulltext
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