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IEC 61760-4
|French -- Technique du montage en surface (SMT) – Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l'humidité - Edition 1.1; Consolidated ReprintSurface mounting technology – Part 4: Classification, packaging, l
Organization:
IEC - International Electrotechnical Commission
Year: 2018
Abstract: This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices, devices for flow (wave) soldering. NOTE Background of this standard and its relation to currently existing standards, e.g. IEC 60749-20 or J-STD-020 and J-STD-033, are described in the INTRODUCTION.
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| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2018-07-31T09:58:10Z | |
| date available | 2018-07-31T09:58:10Z | |
| date copyright | 2018.03.01 | |
| date issued | 2018 | |
| identifier other | JEIWEGAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsessiouthor:%22NAVY%20-%20YD%20-/handle/yse/264419 | |
| description abstract | This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices, devices for flow (wave) soldering. NOTE Background of this standard and its relation to currently existing standards, e.g. IEC 60749-20 or J-STD-020 and J-STD-033, are described in the INTRODUCTION. | |
| language | English | |
| language | French | |
| title | IEC 61760-4 | num |
| title | |French -- Technique du montage en surface (SMT) – Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l'humidité - Edition 1.1; Consolidated ReprintSurface mounting technology – Part 4: Classification, packaging, l | en |
| type | standard | |
| page | 138 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2018 | |
| contenttype | fulltext |