MIL-STD-2198
DESIGN REQUIREMENTS FOR METAL ELECTRICAL BACKPLANE ASSEMBLIES
Organization:
NAVY - SH - Naval Sea Systems Command (Ship Systems)
Year: 1990
Abstract: The purpose of this document is to establish general design requirements for metal electrical backplane assemblies of aluminum sheet or sheets on which separately manufactured component parts, qualified in accordance with MIL-C-28754, have been added.
The metal backplanes of these assemblies are used to provide physical support and location for electronic contacts. The two layer metal electrical backplane assembly may also be used to distribute power or ground throughout the backplane. The electronic module blade contacts engage the tuning fork receptacles in the backplane and are interconnected to other electronic modules via the solderless wrap wire located on the side opposite the contacts on the backplane.
Metal electrical backplane assemblies shall be of the following types:
(a) Type 1: one layer.
(b) Type 2: two layer. Intended Use: The metal electrical backplane assemblies covered by this standard are intended for use in ground support, airborne and shipboard electronic equipment.
The metal backplanes of these assemblies are used to provide physical support and location for electronic contacts. The two layer metal electrical backplane assembly may also be used to distribute power or ground throughout the backplane. The electronic module blade contacts engage the tuning fork receptacles in the backplane and are interconnected to other electronic modules via the solderless wrap wire located on the side opposite the contacts on the backplane.
Metal electrical backplane assemblies shall be of the following types:
(a) Type 1: one layer.
(b) Type 2: two layer. Intended Use: The metal electrical backplane assemblies covered by this standard are intended for use in ground support, airborne and shipboard electronic equipment.
Subject: Double layer metal boards
Collections
:
Show full item record
| contributor author | NAVY - SH - Naval Sea Systems Command (Ship Systems) | |
| date accessioned | 2017-09-04T18:13:11Z | |
| date available | 2017-09-04T18:13:11Z | |
| date copyright | 02/26/1990 | |
| date issued | 1990 | |
| identifier other | HECVDAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quein=auth/handle/yse/196092 | |
| description abstract | The purpose of this document is to establish general design requirements for metal electrical backplane assemblies of aluminum sheet or sheets on which separately manufactured component parts, qualified in accordance with MIL-C-28754, have been added. The metal backplanes of these assemblies are used to provide physical support and location for electronic contacts. The two layer metal electrical backplane assembly may also be used to distribute power or ground throughout the backplane. The electronic module blade contacts engage the tuning fork receptacles in the backplane and are interconnected to other electronic modules via the solderless wrap wire located on the side opposite the contacts on the backplane. Metal electrical backplane assemblies shall be of the following types: (a) Type 1: one layer. (b) Type 2: two layer. Intended Use: The metal electrical backplane assemblies covered by this standard are intended for use in ground support, airborne and shipboard electronic equipment. | |
| language | English | |
| title | MIL-STD-2198 | num |
| title | DESIGN REQUIREMENTS FOR METAL ELECTRICAL BACKPLANE ASSEMBLIES | en |
| type | standard | |
| page | 25 | |
| status | Active | |
| tree | NAVY - SH - Naval Sea Systems Command (Ship Systems):;1990 | |
| contenttype | fulltext | |
| subject keywords | Double layer metal boards | |
| subject keywords | Solderless wrapped interconnections | |
| subject keywords | Standard Hardware Acquisition and Reliability Program (SHARP) | |
| subject keywords | Tuning fork contacts |

درباره ما